An intelligent die bonding production system for semiconductors was constructed for the client. Through the application of equipment technologies such as high-precision side-fork handling robots, multi-level cleanroom-type AGV systems, and intelligent scheduling central control platforms, automated operations for processes like precise material distribution and intelligent tooling handling were realized. Full-process informatized management was achieved to improve wafer packaging efficiency and equipment operation stability.
Die bonding baking carriers
Die bonding materials (straws, dispensing tips, ejector pins, glue tubes, etc.)
The system achieves batch-level full-process traceability of materials such as wafer carriers and colloid consumables through precise scheduling system allocation.
Effectively improves single-machine production efficiency.
(1) Automatic die bonding material distribution for improved labor efficiency and production accuracy: The die bonding equipment system pre-orders materials, and intelligent multi-compartment distribution AGVs automatically deliver materials, meeting the low-frequency distribution needs of multiple stations and ensuring on-time delivery.
(2) Automatic oven docking for higher utilization: Through oven and rack modifications, automatic door opening/closing and integrated material entry/exit from ovens are realized, thereby increasing the effective baking operation time and equipment utilization rate.
(3) Customized structural design for higher internal oven space utilization: Systematically designed racks, fixtures, and AGV forks based on oven dimensions, product sizes, and fixture structures to improve the effective volume ratio of ovens.
